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SCORPION FLS980Dxi Flying Probe Tester

Board test capabilities that go way beyond what other flying probes are capable of.

blue circle Access hard to access components
blue circle Unequaled test coverage
blue circle Prototype & production use
blue circle Configurable to meet your unique needs
blue circle Soft touch probing
blue circle Active warp compensation

Why are dozens of electronics manufacturers in industries ranging from aerospace to automotive and health sciences to semiconductors, depending on the Acculogic Flying Probe Test Platform for their production testing?

Because they can always ship products with a quality they’re proud of. Circuit board test is getting more complicated. In-circuit tests often cost too much, take too long, and cover too little. But production quality needs to be verified without causing production delays, without cost overruns, and without hassles.

Production Test Challenges

Production Test Challenges images

Tight quality control measures and time-to-market pressures are compelling manufacturing companies to choose effective yet lean test and quality control strategies. Flying probe testers require no test fixtures, have few restrictions on board access, and can test boards with a virtually unlimited number of nets.

They also allow developers to complete test programs in a short time. With the SCORPION FLS980Dxi Flying Probe Tester, manufacturers can stay ahead of their competition and economically ensure product quality by catching defects before their customers do.

Flying probe and in-circuit testers (ICT) are used to test printed circuit board assemblies (PCBAs) to ensure quality and functionality.

However, they have some differences in operation, flexibility, and cost-effectiveness.

A flying probe tester is a fixtureless testing tool that utilizes multiple movable test probes to contact specific points on the PCB. It measures the electrical properties of components and checks for shorts, opens, or incorrect component values.

In-circuit testers use a custom test fixture, known as a "bed of nails," to make contact with test points on the PCB. In-circuit testers are generally more suitable for medium to large-scale production.

Flying Probe Testers - key points

  • ➡️No need for custom test fixtures: Flying probe testers do not require test fixtures, making them suitable for low to medium-volume production runs and ideal for prototyping and rapid design changes.
  • ➡️Flexibility: They can easily adapt to different PCB designs and test complex, dense boards.
  • ➡️Shorter setup time: generating test programs is usually quick, and Test programs can be updated to accommodate design changes, enabling faster testing turnaround and reducing production delays.
  • ➡️Lower operating cost: elimination of fixture costs reduces NRE costs, making flying probe testing more cost-effective for prototypes and small to medium production runs.

In-Circuit Testers - key points

  • ➡️Custom test fixtures: ICT uses custom test fixtures, often called "bed of nails," to contact test points on a circuit assembly.
  • ➡️Medium to high-volume production: Electronic manufacturers typically use ICT for medium to high-volume production.
  • ➡️High test speed: In-circuit testers can perform tests faster than flying probe testers, as they can access multiple test points simultaneously, making them suitable for high-volume production.
  • ➡️Higher initial cost/NRE: The custom test fixtures required for ICT can be expensive, especially for low-volume production or prototypes.
  • ➡️Longer test development time: Designing and manufacturing custom test fixtures can lead to more prolonged setup times.
  • ➡️Less flexibility: Any changes in the PCB design may require updates to the test fixture, increasing test preparation time and cost. This makes ICT less adaptable to frequent design changes than flying probe testers.

The FLS 980 Catches Defects Before It’s Too Late


The Flexibility of the FLS 980Dxi



The Scorpion Flying Probe Tester is an effective testing solution that can be used throughout a circuit board's lifecycle. During the prototype testing phase, flying probe testers can quickly and accurately test small production runs, enabling engineers to identify and correct any issues before proceeding with full-scale production. In production testing, flying probe testers can provide high-speed and accurate testing for medium to high-volume production runs. And in repair depot testing, flying probe testers can help diagnose issues with boards that have failed in the field, minimizing downtime and reducing repair costs.

Access Hard-to-Access Devices

Flying Probe access to hard to access devices
Accessing hard-to-reach devices during in-circuit testing can be challenging due to PCB topography factors such as dense component placement, component height, small or fine-pitch devices. In many cases, a Flying Probe Tester is not limited by these access limitations, making it a powerful tool for production and prototype board testing.
blue circle SMD Device Leads
blue circle Test Pads, Vias, Thru-hole
blue circle Resistors, Caps., Diodes, Transistors
blue circle J-Lead Device Pins
blue circle Connector Pins, Tail & Tip

Electrical Test & Inspection Capabilities

Analog Measurement

Passive Components, Shorts, BodeScan Test

Vectorless Testing

ChipScan, C-Scan

Boundary-Scan /JTAG

Test Interconnects & Clusters

Power-up, Functional & RF Testing

Power-up, Dynamic Digital & Analog tests 

Device Programming

Ultra-Fast Device Programming


Passive Components
  • ▫️Resistors
  • ▫️Kelvin measurement
  • ▫️Kelvin measurement w/ two test points
  • ▫️Capacitors
  • ▫️Inductors
  • ▫️Diodes, Zener diodes
  • ▫️Transorbs
  • ▫️Transistors
  • ▫️FETs
  • ▫️Optocouplers
  • ▫️Thyristors
  • ▫️Triacs
  • ▫️Relays, precision relays relay timing
  • ▫️I-V / V-I curves
  • ▫️Voltage measurement
  • ▫️Current measurement


Network Analysis - BodeScan Test
  • ▫️Filter transfer functions
  • ▫️Quartz oscillators’ ability to oscillate
  • ▫️Presence of very small inductances & capacitances


  • Power nets, proximity, adjacent, with reference to a net

Vectorless Testing

Vectorless test-500
The vectorless methods (Patented ChipScan technology & CScan) detect:
blue circle Open pin faults on ICs & BGAs including ungrounded metal caps and heat sinks
blue circle Connector pin faults - horizontal & perpendicular
blue circle Reversed electrolytic capacitors

Boundary Scan/JTAG Test


Boundary Scan is very good at testing for IC shorts on nets that have boundary scan drivers, and it is also very good at detecting IC opens on boundary scan nets that have at least one boundary scan driver and one receiver. If memory devices are connected to scannable parts, they will also have boundary scan coverage.

Using a combination of digital boundary scan stimulus and analog flying probe voltage measurement can be used to test the functionality of certain types of circuits, such as A/D and D/A converters and voltage references.

Power-up, Functional & RF Testing

Flying Probe Functional Test-500
The vectorless methods (Patented ChipScan technology & CScan) detect:
blue circle Power-up
blue circle Interface for communication protocols
blue circle Dynamic Digital & Analog tests with third-party instrumentation

Several sources can be used to power up a UUT inside the FLS980 tester. The ability to power up and flexibly control the UUT allows for functional block testing of onboard power generation circuits, operational amplifier circuits, and simple voltage tests. The UUT power supplies have standard current and voltage monitoring capabilities, which can be used to limit or sample board draws under different load conditions. This flexibility in powering the UUT allows for more extensive test coverage and can help ensure that the device or system being tested is functioning properly and meets the necessary specifications.

On-Board Device Programming

On board Programming

Advanced Probe Module Features

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Programmable probe angle - Omni-directionally on the horizontal, and -6° to +6° on the vertical planes - the taller the parts present on the unit under test the more important variable angles become. Taller components can obstruct the path of the probes, making it difficult to access test points. By adjusting the angle at which the probes contact the PCB, you can ensure that they are contacting the intended test points, even if the PCB layout is complex or the test points are not easily accessible.
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Programmable X, Y & Z axis - the adjustable range in the Z-axis is probing up to 42 mm for fly over and up to 85 mm for fly-around.
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Programmable probe speed
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Programmable “No-Fly Zones”
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Field Oriented Control (FOC) - uses mathematical algorithms to determine the best way to move the probes to contact the test points on the PCB. The algorithm considers the position of the probes, the layout of the PCB, and the height of any components that may obstruct the path of the probes. This allows the FOC system to adjust the probe angles, speed, and trajectory in real-time, to ensure that the probes contact the correct test points, without damaging the PCB or the probes.
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Double sided Probing - Faster test times & enhanced test coverage

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Large Test Area - Test large boards & boards with tall components: 642x 1200 mm max board size

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Automatic Board Handling - Production line integration with autonomous loading and unloading options.

Ultra-Accurate Probing & Positioning System

1-micron minimum step size, +/-10 micron positioning repeatability
blue circle iconClosed-loop drives for shuttles and probe modules ensure precise and repeatable positioning of the probes. Riding on a 12-micron air gap, shuttles travel friction-free and without mechanical contact on the stator plane, thus operating without wear.
blue circle iconHigh-resolution fiducial detection cameras, precise lighting, and advanced image processing software ensure precise and repeatable detection of fiducial marks on the UUT, as well as correct compensation for any offsets. Once the camera system locates the board in the X and Y planes, the LaserScan module is used to complete the 3D contour map of the board in the Z-plane.
blue circle iconOn-board Device Programming
blue circle iconThe electronic measurement system relies on precision circuits and components for reliable and repeatable measurements.
blue circle iconSoft Touch Probing – The Integrator Pro™ system control software, with sophisticated motion control and measurement algorithms, ensures robust and repeatable operation.

Optical & Thermal Inspection Capabilities


Automated Optical Inspection & Microscopy

white circle iconcheck for the presence, absence, orientation, and polarity of components
white circle iconread 2D & 3D barcodes

LED test

white circle iconcheck the hue, saturation, and intensity of SMT or edge-mounted LEDs
white circle iconread 2D & 3D barcodes

Thermal profile verification


Active Warp Compensation
LaserScan allows the FLS980 to accurately locate and map a unit under test's (UUT) Z-height topography, so that the tester can automatically compensate for any board warping or thickness differences.

LaserScan will map the board's z-height in as many locations as the user requires, to accurately determine the position of the UUT to within +/- 50 micrometers in the z-axis. So, LaserScan prevents any probing inaccuracies resulting from board warpage.

Flying Fixture

A small Bed of Nails mounted on a shuttle is used for:

blue circle High current power up & functional test
blue circle High-frequency test applications
blue circle Flash programming
blue circle Fast Boundary Scan test
blue circle Other complex test applications

INTEGRATOR Operating Software

Fully integrated software moves you quickly from test program development to production test deployment.
Scan Navigator
Integrator Project

Test program generation for the FLS980 test platform is highly automated, simple, and intuitive. The automatic test program generator and operating software (INTEGRATOR) manages all aspects of test program and moves you quickly from test program development to production test deployment.

blue circle iconINTEGRATOR includes: Acculogic's XMatic™ software, which automatically generates output files for most commercial In-Circuit, Flying Probe, Boundary Scan/JTAG testers, and AOI machines. With its user-guided nail/probe selection routine and complementary interactive tools, XMatic offers complete flexibility and control during fixture design and flying probe selection.

Reverse Engineering

Rebuild CAD Data and Electrical Schematics

The FLS980DXi is an automated low-cost alternative to manual or semi-automated reverse engineering methods.

blue circle iconIntelligently maps board connectivity through probing pads on the board
blue circle iconRecreates netlist for test program generation
blue circle iconGeneration of input data for test program development
blue circle iconGeneration of electrical design data
blue circle iconAides the design of a new revision board
blue circle iconAccessibility to both sides of the PCB
blue circle iconFast learn process with multiple probing in one pass
blue circle iconSoft touch probing reduces wear on learned PCB contact points
blue circle iconLearn time reduction with increased probe count
blue circle iconIntegrated software tools minimize processing time
Reverse Engineering
Item Specification Value [mm]
Fine Pitch Probe Tip* Thickness at the tip:
Ultrafine Pitch Probe Tip Thickness at the tip:
Low Force Rounded Tip Thickness at the tip:
Cup Probe Tip Thickness at the tip:
Standard Probe Tip Thickness at the tip:
Chisel Head Thickness at the tip:
RF Signal Probe Tip 2 Pin Head  


*- Standard offering with FLS980Dxi system with 1.5N probing force
*-Probes can come with different probing force including 0.6 N; 0.8; 1.5 N; 2.25; 3.0 N nominal values

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