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Tight quality control measures together with time to market pressures are compelling manufacturing companies to choose effective yet lean test and quality assurance strategies in their production processes. Flying probe testers require no test fixtures, have few restrictions on board access, and can test boards with virtually unlimited number of nets. They also allow developers to complete test programs in a short time. For these reasons and more, flying probe testers have become indispensable tools in today’s electronic manufacturing.

New Flying Scorpion FLS900Dx “The Ultimate Probing Machine

Application of new and innovative design features to increase test speed, board access, reliability, and repeat-ability, have opened up new possibilities for deployment of Acculogic’s FLS900 series testers. As the first patented flying prober with double sided testing and 24 interchangeable probe modules, the FLS900 is leading the way in defining new leaner and more efficient deployment models for production environments.

Three generations of our Flying Probe testers have been selected by original equipment manufacturers (OEMs) and electronic manufacturing service (EMS) companies across the world to meet their most demanding technological and operational requirements.

Key Features

  • Full Function Double Sided System
  • Closed Loop AccuFast Drive System with ±0.1 Micron resolution
  • Configurable with up-to 24 Closed Loop Flying Probes
  • Programmable probe angle +6º to -6º degrees
  • Extensive Test capabilities Analog, Digital, Mixed signal and Boundary Scan
  • Power-on testing
  • Up-to 128 non-Mux test channels through fixed nails
  • Test largest boards 41”x 25.5” (1050 x 640mm)

ACCESS

Shrinking component sizes and denser chip scale packaging technologies are posing new challenges to test engineers. Test pads, traditionally installed on PCBs, are being eliminated from many designs thus reducing physical access. Flying Probers are required to operate with unprecedented precision in order to meet the new challenges. FLS900 uses highly repeatable closed loop linear motor drives and joystick-like variable angle probe modules to maximize physical access and guarantee repeatable probing of fine pitch devices and small components like 0201, 01005s. FLS900 offers double sided probing and up to 24 probe modules on the component and solder side of the Unit Under Test (UUT) to facilitate efficient single pass testing.

ACCURACY

Due to its modular and scalable architecture, the FLS900 guarantees superior probing precision and repeatability. Precise Closed Loop planar linear motors (shuttles) with “AccuFast™ Drive System” (±0.1 micron positioning resolution) independently move probe modules and cameras. The probe modules utilize equal-length identical probes to contact target points on the UUT. Each probe module is able to set the probing angle from 0º to 6º from vertical in any direction. The combination of shuttles’ positioning and joy-stick like probe motion ensures unmatched accessibility to points on the UUT. You can now test
boards whose layout, size, and technology defy testing on traditional in-circuit and other moving probe testers.

FLS900 system architecture ensures repeatability:

  • Closed Loop Drives for shuttles and probe modules ensure precise and repeatable positioning of the probes.
  • Riding on 12 micron air gap, shuttles travel free of friction and with no mechanical contact on the stator plane and therefore operate free of wear.
  • High resolution fiducial detection cameras, precise lighting, and advanced image processing software ensure precise and repeatable detection of fiducial marks on the UUT as well as correct compensation for any offsets.
  • The electronic measurement system relies on precision circuits and components for reliable and repeatable measurements.
  • Integrator Pro™ system control software with sophisticated motion control and measurement algorithms ensures robust and repeatable operation. Highest Fault Coverage

The high speed and precision analog measurement unit provides 4-wire measurements capability for all 24 flying probes (top and bottom sides). All probes can perform in-circuit tests as drivers, sensors, or guards on discrete and integrated analog/digital components.

PROBING ANGLE

Warping of printed circuit boards is a common issue that should be taken into account in SMT board assembly, inspection and test processes. During Flying Probe test, board warp changes the physical position of target points by an offset. When probing angle is 0 degrees from vertical, board warp will cause no probing errors, however, as the probing angle increases, the probing error also increases. A 0201 chip on a board with 0.5 mm warp using 15 degree probing angle cannot be probed dependably. Decreasing probing angle to 3 or 4 degrees reduces warp related uncertainty, and leads to reliable probing.

As probing angle increases the probe slippage factor increases. Probe slippage can lift pads and vias and leave unacceptable marks on the target.

SPEED

Test time on Flying Probe depends mainly on the number of test steps and speed of probe movement. Shorts Test consume a large part of overall test time. FLS900’s flexible measurement system provides a host of test strategies including Boundary Scan (JTAG) and NetScan™ to significantly reduce test time without impacting test coverage or repeatability. In addition AccuFast™ Drive system boosts speed and acceleration by 4 times over open loop systems.

Key Features of AccuFast Drive System™

  • Significantly faster than open loop systems (4x)
  • High acceleration (4x)
  • Enhanced probing accuracy
  • Three times better dynamic response +/- 1 degree rotation
  • Automatic orthogonality between X and Y axis
  • Sensorless homing (no adjustments)
  • DSP based motor controller
  • Built-in linear and parabolic interpolation (more efficient shuttle movements)
  • Low energy usage (50% reduction)

Boundary Scan (JTAG) testing can reduce the overall “shorts” and “opens” test time by up-to 80%.

PATENTED MULTI-PROBE SYSTEM

The FLS900 has a modular architecture that is expandable to 24 probes. The probe modules have easily interchangeable probe tips. A range of probe tip styles are available off the shelf. In addition to providing excellent test coverage on densely populated circuit boards, this flexibility makes the FLS900 an ideal solution for testing backplanes where direct contact with connector
pin tips is required.

FLS900 systems can be configured with Acculogic’s patented Multi-nail Probe Module (MPM) which provides the functionality of a small bed-of-nail access in the flying probe system a “Flying Fixture”. This customizable Probe Module can be used in functional testing, digital, boundary scan (JTAG) testing and more. Its low cost and flexibility makes MPM an indispensible addition to the system.

MEASUREMENT SYSTEM

High speed (up-to 1000 measurements/sec) and precision analog measurement system provides 4-wire measurements capability for all 24 flying probes (top and bottom side). All probes can perform in-circuit tests as drivers, sensors, or guards on discrete and integrated analog/digital components. Analog testing of resistors, capacitors, inductors, diodes, Zeners, transistors, FETS, thyristors, opto-couplers, switches, trimmers, relays, fuses and connectors is available on the FLS900. These include 2-wire and 4-wire tests, device ON and OFF tests using two sets of separately available stimulus/measurement resources. Also, power-on testing for voltage regulators and operational amplifiers are possible using the voltage measurement module.

SOFTWARE

Integrator Pro Features:

  • Automatic program generation software
  • Built-in Boundary Scan (JTAG)
  • Automatic multi-level guard assignment
  • Auto-debug (unattended)
  • Test Sequence with logical flow control
  • Interactive board description editor add/modify test points, package etc.
  • Panelization support
  • Program and motion optimization
  • Powerful Script language for functional and advance testing
  • Test coverage report generation
  • Statistical Process Control (SPC)
  • RepairMatic™ graphical repair station software

Test program generation for FLS900 testers is highly automated, simple, and intuitive. The process starts by using the XMATIC™ software to translate UUT data from any of the 35-plus commonly used CAD formats. CAD data is merged with the Bill ofMaterials, and other relevant information to create an output file that contains data elements required to automatically generate test programs.

Integrator Pro is the automatic test program generator (ATPG) and operating software that manages all aspects of test program sequencing, debugging, optimizing, and execution on the Flying Scorpion. The Integrator Pro also manages all physical resources of the tester including motion, vision, electrical stimulus and measurement.

Integrator Pro supports many different plug-in modules such as Boundary Scan, BodeScan and FlashScan etc. which enhance test coverage and increase execution speed. An easy-to-use scripting language opens up internal resources of the tester, providing users with maximum flexibility to write complex test protocols with simultaneous use of multiple probe modules.

The Integrator Pro is also equipped with an impressive set of tools for statistical process control, test execution flow management, and test coverage report generation. Interfaces to automatic repair processes, and automatic test program management (version control) are available.

BodeScan™

BodeScan™ is a unique built in network analyzer that extends the system fault coverage to small value resistors, capacitors, and inductors in complex networks found on RF boards.

VECTORLESS TEST

PinScan™ Patented Open Pin Detection suite
PinScan is a complimentary suite of analog and digital test techniques for detecting Opens on ICs, including BGAs, as well as connectors and polarized capacitors.

  • CScan™ is a patented technique used in vectorless testing of ICs and connector pins. CScan is used to test open pins as well as the polarity of electrolytic capacitors. CScan functionality detects open pins on devices located on the top and/or bottom side of the board.
  • ChipScan™ is a patented 3-pin technique for vectorless open testing on digital IC pins. It exploits the parasitic diodes/transistors in each digital IC, and tests each pin for open faults. Power up is not required in order to use ChipScan. This method is particularly useful where bus structures are used. ChipScan detects wire bonding defects, open pins and cold joints. ChipScan functionality is available on all probes covering top and bottom side of the unit under test.
  • ScanProbe™ is a digital technique that uses flying probes to detect opens on digital IC pins of devices that are IEEE-1149.1(JTAG) compliant. ScanProbing is fast and repeatable, uses the digital and boundary scan capability of the FLS900 for fault detection.

BOUNDARY SCAN

Features:

  • Fully integrated hardware and software
  • IEEE1149.1 and IEEE 1149.6 supported
  • Support for multiple scan chains up-to 8
  • Scan and non-scan testing
  • Automatic test optimization
  • Automated test generation and intelligent diagnostics

Boundary scan (JTAG) is a test methodology based on IEEE 1149.1 standard. Compliant Semiconductors, when installed on a circuit board, allow the interconnecting nets and digital clusters such as memory devices to be tested on the FLS900. Furthermore, Boundary Scan offers a comprehensive board-level protocol for programming flash and other programmable devices.

Integration of boundary scan with flying probe systems is no longer an option but a requirement since the combined strategy improves test coverage and test time.

Boundary scan is an integral part of the FLS900; digital test patterns generated by Acculogic’s powerful ScanNavigator software are delivered to the UUT through Probe Modules or board carrier system. FLS900 goes beyond interconnect testing by providing full digital test capability when and where needed. This technological break-through is made possible by merging
Acculogic’s two powerful software suites, the “Integrator Pro” and the “ScanNavigator”.

“Boundary Scan, not an afterthought but an Integral part of the System”

FLS900’s advanced boundary scan extends the testing to assemblies that contain a mix of Scan and non-Scan logic by providing Shorts Test between boundary scan nets and non-boundary scan nets where the non-scan nets have flying probe access.

Benefits

  • Dramatic increase in test coverage by combined use of flying probe and boundary scan resources
  • More efficient shorts test using flying probes and higher throughput
  • Reusable Boundary Scan test patterns

VISION TEST

OptiScan™ a multi-camera dual sided vision system with precise lighting, and advanced image processing software provides vision inspection for presence, absence and orientation of components such as decoupling capacitors, polarity of electrolytic capacitors and presence of mechanical parts.

OptiScan Features:

  • Up-to 8 (4 top/4 bottom) high resolution CCD cameras
  • Flexible target illumination
  • 1D and 2 D bar code reader
  • Optical Character Recognition (OCR)

Advance Function Testing

FLS900 system’s open architecture supports integration of general purpose instrumentation through the FSM Switch Matrix Card. Acculogic provides device drivers for an extensive list of instruments.

DEVICE PROGRAMMING

FlashScan™ – In-Circuit Device Programming
Programmable devices such as PLDs, Flash, PROMs are frequently used on most modern circuit board assemblies. In-production-programming (configuration) of these devices provides the flexibility for on-the-fly content changes as opposed to using pre-programmed parts. Device Programming on the FLS900 improves production efficiency by removing an extra step in the production process.

FlashScan™ is a multi-vendor integrated hardware and software suite that provides the FLS900 with capability to program and verify a wide range of devices.

SPC SOFTWARE

Statistical Process Control Software
Integrator Pro’s SPC software is a powerful statistical process control (SPC) tool that analyzes and identifies variations in test results due to variations in process environment. Using a series of measurements made repeatedly on a single board or on batches of production boards, developers are able to identify measurements that are least stable. They can then examine these measurements for root causes of instability and alleviate the causes. SPC software allows developers to analyze test variance due to noise, component variation, drift, and system variance. Test limits can be updated automatically under user control to obtain solid production-ready tests.

SYSTEM CONFIGURATION (PM)
Model Test Area Top/Bottom Side Max. Probe Module/Side Total Probe Module/System
910DX 33" x 25.5"
830mm x 640mm
Top

8

16
Bottom 8
920DX 41" x 25.5"
1,050mm x 640mm
Top

8

16
Bottom 8
950DX 41" x 25.5"
1,050mm x 650mm
Top

20

24
Bottom 20

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